产品特点
产品功能
产品简介：
Leetop-SUBKIT-618是基于NVIDIA Jetson Orin NANO/Orin NX模组的高性能边缘AI计算平台 专为嵌入式AI应用设计，如智能安防、机器人、工业 自动化、视觉检测等领域。该平台具备强大的AI推理 性能，多路视频处理能力，并兼容各种传感器与接口， 便于开发和部署。
产品规格 ：
处理器模块 ：
| Module | Orin NX 8GB | Orin NX 16GB |
| AI Performance | 117 TOPs | 157 TOPs |
| GPU | 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores | |
| CPU | 6-core NVIDIA Arm® Cortex A78AE v8.2 64- bit CPU 2MB L2 + 4MB L3 | 8-core NVIDIA Arm® Cortex A78AE v8.2 64- bit CPU 2MB L2 + 4MB L3 |
| Memory | 8GB 128-bit LPDDR5 102.4GB/s | 16GB 128-bit LPDDR5 102.4GB/s |
| Storage | — (Supports external NVMe) | |
| Video Encode | 1x 4K60 (H.265) 3x 4K30 (H.265) 6x 1080p60 (H.265) 12x 1080p30 (H.265) | |
| Video Decode | 1x 8K30 (H.265) 2x 4K60 (H.265) 4x 4K30 (H.265) 9x 1080p60 (H.265) 18x 1080p30 (H.265) | |
| CSI Camera | Up to 4 cameras (8 via virtual channels***) 8 lanes MIPI CSI- 2D-PHY 2.1 (up to 20Gbps)) | 2x MIPI CSI-2 22-pin Camera Connectors |
| Display | 1x 8K60 multi-mode DP 1.4a (+MST)/eDP1.4a/HDMI 2.1 | |
| Power | 10W - 15W - 25W - 40W | 10W - 15W - 25W - 40W |
| Module | Orin Nano 4GB | Orin Nano 8GB |
| AI Performance | 34TOPS | 67 TOPS |
| GPU | 512-core NVIDIA Ampere architecture GPU with 16 Tensor Cores | 1024-core NVIDIA Ampere architecture GPU with 32 Tensor Cores |
| CPU | 6-core Arm® Cortex®-A78AE v8.2 64-bit CPU 1.5MB L2 + 4MB L3 | |
| Video Encode | 1080p30 supported by 1-2 CPU cores | |
| Video Decode | 1x 4K60 (H.265) 2x 4K30 (H.265) 5x 1080p60 (H.265) 11x 1080p30 (H.265) | |
| Memory | 4GB 64-bit LPDDR5 51 GB/s | 8GB 128-bit LPDDR5 68 GB/s |
| Storage | — (Supports external NVMe) | |
| CSI Camera | Up to 4 cameras (8 via virtual channels***) 8 lanes MIPI CSI-2D-PHY 2.1 (up to 20Gbps) | |
| Power | 7W - 10W - 25W | 7W - 15W - 25W |
产品规格 ：
| Feature | Specification |
| Module Compatibility | Jetson Orin NANO/ Orin NX |
| Display | 1x DP |
| Ethernet | 1x Gigabit Ethernet (10M/100M/1000M) |
| USB | 4x USB 3.2 Type A(Integrated USB2.0) 1x USB 2.0+3.2 TYPE C |
| Camera | 2 x 4 lane csi camera |
| M.2 KEY M | 2x M.2 KEY M (SSD;SIZE:2230/2280) interface |
| M.2 KEY E | 1xM.2 KEY E(WIFI) interface |
| FAN | 1xFAN(5V PWM) |
| CAN | 1xCAN |
| RTC CON | 1x3.0V RTC |
| Function CON | 2x SPI BUS；2x I2C； 2x UART；1x I2S; 6x GPIO； |
| DC | power interface |
| Project | Specification |
| Input Voltage | +9V ---+20V (MAX 60W) DC Input |
| Load capacity | Above 60W |
| Dimensions (W×D ×H) | 100x80.7x34.1(mm) |
| Operating Temperature | -25℃- 65℃ |
| Storage Temperature Humidity | -20 ℃ -65 ℃ 10% -90% Non condensation environment |